Shopping Cart
0 item
New Customers
By creating an account with our store, you will be able to move through the checkout process faster, store multiple shipping addresses, view and track your orders in your account and more.
You may also be interested in the following product(s)
The Flex EX memory series features breakneck speeds demanded by enthusiasts in an updated compact form factor to maximize memory configurations on your motherboard. These premium high-density modules operate at incredibly fast DDR2 and DDR3 speeds to run the latest memory-intensive games and applications, and offer enthusiasts the thermal management necessary for the stability and performance on high-end gaming and overclocking systems.
The OCZ Flex EX heat management solution enables high-frequency memory to operate within an optimal balance of extreme speeds and low latencies without the high temperatures that inhibit or damage the module. Each Flex EX memory module features this breakthrough thermal management technology from OCZ, combining an effective new heatspreader design with integrated liquid injection system and dedicated channels directly over the module's Ics in a thinner form factor. This latest series was engineered with a unique "flexible" design to give enthusiasts the option to run the modules passively or water cooled via the array of aluminum fins, and the concurrent use of both options promotes maximum heat dissipation.
The Flex EX modules are optimized for the latest cutting-edge platforms and will be available in 4GB (2x2048MB) dual channel kits for ultimate bandwidth.
1200MHz DDR2
CL 6-6-6-18
Availablein 4GB (2x2048) Dual Channel Kits
Unbuffered
2.2 Volts
240 Pin DIMM
2 x 1/8" ID (inner diameter)barbs
Special Features
Flex EX XLC Heatsink
2.25 EVP
The OCZ Flex EX heat management solution enables high-frequency memory to operate within an optimal balance of extreme speeds and low latencies without the high temperatures that inhibit or damage the module. Each Flex EX memory module features this breakthrough thermal management technology from OCZ, combining an effective new heatspreader design with integrated liquid injection system and dedicated channels directly over the module's Ics in a thinner form factor. This latest series was engineered with a unique "flexible" design to give enthusiasts the option to run the modules passively or water cooled via the array of aluminum fins, and the concurrent use of both options promotes maximum heat dissipation.
The Flex EX modules are optimized for the latest cutting-edge platforms and will be available in 4GB (2x2048MB) dual channel kits for ultimate bandwidth.
Special Features
My Cart
You have no items in your shopping cart.
Designated trademarks and brands are the property of their respective owners.
