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This module is based on thirty-six 128M x 8-bit 667MHz DDR2 FBGA components. The module also includes an AMB device (Advanced Memory Buffer).
| FBDIMM Module | 240-pin | |
| JEDEC Standard | - | |
| Memory Organization | 4 rank of x8 devices | |
| DDR2 DRAM Interface | SSTL_18 | |
| DDR2 Speed Grade | 667 Mbps | |
| CAS Latency | 5-5-5 | |
| Module Bandwidth | 5.3 GB/s | |
| DRAM | VDD = VDDQ = 1.8V | |
| AMB | VCC = VCCFBD = 1.5V | |
| EEPROM | VDDSPD = 3.3V (typical) | |
| Heat Spreader | Full DIMM Heat Spreader (FDHS) | |
| PCB Height | 30.35mm, double-side |
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